Food Grade Heat Sink Compound

Product Description

#x0D; White Ice 510 is a non-reactive, Silicone, Thermally Conductive Grease with a high thermal conductivity and low thermal resistance with a soft, non-flowable and scree printable consistency.  This product is formulated with specialty binding agents to achieve lowest amount of bleed and evaporations.  It is designed for applications where a silicone thermal interface material is required and where the device may later need to be easily removed from the heat sink.  This compound is ideally suited for use in thin cross-sectional thicknesses down 1 mil.  Made in the USA. Thermal Conductivity ( 0.8 W/m-K ) Thixotropic Paste RoHS Compliant-Halogen Free Thin BLT less than 5 micron Minimum Bleed and Evaporation APPLICATIONS Interface for semiconductors requiring low pressure or spring clamp mounting Thermal sensors, TEC modules, Thermal Wells IGBTs, LED Power Transistors, Diodes, Power Resistors CPU/GPU/Heat Sink .
White Ice 510 is a non-reactive, Silicone, Thermally Conductive Grease with a high thermal conductivity and low thermal resistance with a soft, non-flowable and scree printable consistency.  This product is formulated with specialty binding agents to achieve lowest amount of bleed and evaporations.  It is designed for applications where a silicone thermal interface material is required and where the device may later need to be easily removed from the heat sink.  This compound is ideally suited for use in thin cross-sectional thicknesses down 1 mil.  Made in the USA. Thermal Conductivity ( 0.8 W/m-K ) Thixotropic Paste RoHS Compliant-Halogen Free Thin BLT less than 5 micron Minimum Bleed and Evaporation APPLICATIONS Interface for semiconductors requiring low pressure or spring clamp mounting Thermal sensors, TEC modules, Thermal Wells IGBTs, LED Power Transistors, Diodes, Power Resistors CPU/GPU/Heat Sink

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